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The use of a laser to provide localised heating is an ideal solution to the problem of packaging microelectro- mechanical-systems (MEMS) whilst maintaining a low device temperature to avoid changes in temperaturesensitive materials in the device. In this paper we present localised laser bonding of glass to silicon (normally used as the MEMS substrate) by using a fibre-delivered high power laser diode array to cure an intermediate layer of the thermosetting polymer Benzocyclobutene (BCB). In our experiments, we use two techniques to realise localised heating: one is to use an axicon together with a conventional positive lens to generate a ring focus; the other is to use a scanning focused laser beam. In both cases localised cooling is required to confine the elevated temperatures to the bonding area.
Qiang Wu, N. Lorenz, and D.P. Hand, “Localised laser joining of glass to silicon with BCB intermediate layer”, Microsystem Technologies, vol. 15, no. 7, pp. 1051-1057, 2009. doi:10.1007/s00542-009-0879-1