Antimicrobial Properties of Vertically Aligned Nano-Tubular Copper

Authors

Kafil Razeeb, University College Cork
Joanna Podporska-Carroll, Technological University Dublin
Mamun Jamal, University College Cork
Maksudul Hassan, University College Cork
Michael Nolan, University College Cork
Declan McCormack, Technological University DublinFollow
Brid Quilty, Dublin City University
Simon Newcombe, Glebe Scientific Limited
Suresh Pillai, Technological University DublinFollow

Document Type

Article

Rights

Available under a Creative Commons Attribution Non-Commercial Share Alike 4.0 International Licence

Disciplines

1.3 PHYSICAL SCIENCES, 1.4 CHEMICAL SCIENCES, 1.6 BIOLOGICAL SCIENCES

Publication Details

Materials Letters, 128, 2014, 60–63.

Available here.

Abstract

In this work, the antimicrobial properties of vertically aligned nano-tubular Cu arrays (NT-Cu) fabricated via a template-based electrodeposition approach were investigated. The NT-Cu display good bactericidal activity against S.aureus and bacteriostatic properties against E.coli, S.sonnei, S.enterica and C.albicans. In contrast, Cu-foil electrodeposited from the same solution shows low biological activity against the same microorganisms. The antimicrobial activity of NT-Cu depends on both the type of microorganism and exposure time. After 6 hours of exposure, over 99.99% (log red = 4.43) of S.aureus population was inactivated, whereas, for E.coli, S.sonnei, S.enterica and C.albicans it was 97.8, 94.2, 89.9, and 90.3%, respectively.

DOI

https://doi.org/10.1016/j.matlet.2014.04.130

Recommended Citation

Razeeb, K. et al (2014). Antimicrobial properties of vertically aligned nano-tubular copper. Materials Letters, vol.128, pp.60-63. doi:10.1016/j.matlet.2014.04.130