Document Type

Article

Rights

Available under a Creative Commons Attribution Non-Commercial Share Alike 4.0 International Licence

Disciplines

Physical chemistry, Electrochemistry, Electrical and electronic engineering, Coating and films

Publication Details

Transactions of the IMF 2014 VOL 92 NO 3

Abstract

The miniaturisation of electronic components coupled with requirements for high temperature lead free soldering has forced the improvement of the termination finish of surface mount components to meet the critical demands of the electronic industry. In the present work the processing parameters necessary to plate miniature multilayer varistors (MLV’s) have been explored. The tooling selected was a “Rotary flow-thru’ plater” which achieved high volume plating with

DOI

https://doi.org/10.1179/0020296714Z.000000000175

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